Multilayer Prototypes Inc.

877.629.9320

BUILDING HIGH QUALITY PRINTED CIRCUIT BOARDS SINCE 1981

Multilayer Prototypes Inc.
Quick-Turn PCB Manufacturing

Fabrication Capabilities

Board Types

• Rigid • Duroid
• Rigid Flex • Ceramic
• Flex • Metal Core


Layer Count

  • 1 - 24 layers

Materials Available

  • Fr-4 (IPC-4101/21/24/26/28/121/124/126/129)
  • Black Fr-4
  • Polyimide (IPC-4101/40/41)
  • Kapton
  • Roger’s 3000, 4000, 5000, 6000 series laminates
  • Roger’s TMM laminates
  • Taconic TSM-DS & TLX-9
  • Bergquist T-clad aluminum and copper core
  • Cuflon
  • Polyflon
  • G200 BT/Epoxy (IPC-4101/30)

Dimensions

  • Maximun panel size 24 x 30 (22 x 28 usable PCB area)
  • Minimum panel size 6 x 6" (for small prototype quantities)
  • Maximum Board Thickness: 250 mil (overall)
  • Minimum Board Thickness: 1.5 mil (overall)

Copper Weights and Mininum Line/Space

Cu Width
.25 oz 2.8 mil
.5 oz 3 mil
1 oz 5 mil
2 oz 8 mil
3 oz 12 mil
4 oz 15 mil

5 oz and up, engineering review required

Vias and Component Holes

  • Hole size to O/A Thickness Ratio > 1:8
  • Smallest mechanical via 5 mil
  • Blind & Buried Vias – Yes
  • Microvias – Yes
  • Conductive & Non-conductive Hole Fill

Metal Finish Options

  • HASL (Hot Air Solder Level)
  • Lead-Free HASL
  • Immersion Gold (ENIG)
  • Immersion Tin
  • Immersion Silver
  • Soft Bondable Gold
  • Hard Gold
  • Rhodium
  • OSP
  • PPT
  • Selective  Plating

Misc Capabilities

  • Edge Plating
    • Hole Fill
    • Heatsinks
    • Countersinks & Counterbores
    • Impedance Control
    • Selective  Plating

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THE ABOVE SPECIFICATIONS ARE GENERIC AND SHOULD ONLY BE USED AS A GUIDE.
ALL DESIGNS ARE SUBJECT TO REVIEW BY MPI’S ENGINEERING GROUP PRIOR TO ACCEPTANCE.
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