Capabilities

  • Board Types

    Rigid

  • Rigid Flex

  • Flex

  • Duroid

  • Ceramic

  • Metal Core

  • Layer Count

    1-24 Layers

  • Materials Available

    Fr-4 (IPC-4101/21/24/26/28/121/124/126/129)

  • Black Fr-4

  • Polyimide (IPC-4101/40/41)

  • Kapton

  • Roger’s 3000, 4000, 5000, 6000 series laminates

  • Roger’s TMM laminatese

  • Taconic TSM-DS, TLY-5(z) & TLX-9

  • Bergquist T-clad aluminum and copper core

  • G200 BT/Epoxy (IPC-4101/30)

  • Dimensions

    Maximun panel size 24 x 30 (22 x 28 usable PCB area)

  • Minimum panel size 6 x 6" (for small prototype quantities)

  • Maximum Board Thickness: 250 mil (overall)

  • Minimum Board Thickness: 1.5 mil (overall)

  • Laser Cutting (Machining)

    Intricate cut outs and precise outlines

  • Copper Weights and Mininum Line/Space

    Cu .25 oz, Width 2.8 mil

  • Cu .5 oz, Width 3.0 mil

  • Cu 1 oz, Width 5.0 mil

  • Cu 2 oz, Width 8 mil

  • Cu 3 oz, Width 12 mil

  • Cu 4 oz, Width 15 mil

  • Cu 5 oz and up, engineering review required

  • Vias and Component Holes

    Hole size to O/A Thickness Ratio > 1:8

  • Smallest mechanical via 5 mil

  • Blind & Buried Vias – Yes

  • Microvias – Yes

  • Conductive & Non-conductive Hole Fill

  • Metal Finish Options

    HASL (Hot Air Solder Level

  • Lead-Free HASL

  • Immersion Gold (ENIG)

  • Immersion Tin

  • Immersion Silver

  • Soft Bondable Gold

  • Hard Gold

  • Rhodium

  • OSP

  • Selective Plating

  • Miscellaneous

    Edge Plating

  • Hole Fill

  • Heatsinks

  • Countersinks & Counterbores

  • Impedance Control

  • Selective Plating